Proceedings Joint IEEE/INRIA Conference on Emerging Technologies for Factory Automation, Paris, France, September, 1995
A Constraint-Posting Framework for Scheduling Under Complex Constraints
Cheng-Chung Cheng and Stephen F. Smith
The Robotics Institute
Carnegie Mellon University
Pittsburgh, PA 15213, USA
Abstract
Scheduling in many practical industrial domains is complicated by the
need to account for diverse and idiosyncratic constraints. Quite often these
requirements are at odds with the techniques and results produced by the
scheduling research community, which has focused in large part on
solutions to more idealized, canonical problems. Recent research in
temporal reasoning and constraint satisfaction has produced problem solving
models that operate with respect to much more general representational
assumptions. These frameworks offer possibilities for developing scheduling
technologies that naturally extend to accommodate the peculiarities of
various application domains. One critical issue, of course, is whether such
generality can be obtained without sacrificing scheduling performance.
In this paper, we investigate this issue through application of a previously
developed constraint satisfaction problem solving (CSP) model for deadline
scheduling to a complicated, multi-product hoist scheduling problem
encountered in printed circuit board (PCB) manufacturing. The goal is to
maximize throughput of an automated PCB electroplating facility while
ensuring feasibility with respect to process, capacity and material movement
constraints. Building from a heuristic procedure generically referred to as
PCP (precedence constraint posting), which relies on a temporal constraint
graph representation of the problem, we straightforwardly define an extended
solution procedure for minimizing makespan. In a series of comparative
experiments, our procedure is found to significantly outperform previously
published procedures for solving this hoist problem across a broad range of
input assumptions.
The research reported in this paper has been sponsored in part by the
National Aeronautics and Space Administration, under contract NCC 2-531, by
the Advanced Research Projects Agency under contract F30602-90-C-0119 and
the CMU Robotics Institute. The authors can be reached through email at
sfs@cs.cmu.edu.
Full paper in Postscript