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Electrostatic Latching for Inter-module Adhesion, Power Transfer, and Communication in Modular Robots

 

In Proceedings of the IEEE International Conference on Intelligent Robots and Systems (IROS '07)

Mustafa Emre Karagozler, Jason D. Campbell, Gary K. Fedder, Seth Copen Goldstein, Michael Philetus Weller, and Byung W. Yoon

October, 2007

Abstract


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@inproceedings{karagozler-iros07,
  author = {Karagozler, Mustafa Emre and Campbell, Jason D. and
     Fedder, Gary K. and Goldstein, Seth Copen and Weller, Michael
     Philetus and Yoon, Byung W.},
  title = {Electrostatic Latching for Inter-module Adhesion, Power
     Transfer, and Communication in Modular Robots},
  booktitle = {Proceedings of the IEEE International Conference on
     Intelligent Robots and Systems ({IROS '07})},
  venue = {IEEE/RSJ International Conference on Intelligent Robots and
     Systems (IROS)},
  see = {karagozler-msreport07},
  year = {2007},
  month = {October},
  abstract = {A simple and robust inter-module latch is possibly the
     most important component of a modular robotic system. This paper
     describes a latch based on capacitive coupling which not only
     provides significant adhesion forces, but can also be used for
     inter-module power transmission and communication. The key
     insight that enables electrostatic adhesion to be effective at
     the macroscale is to combine flexible electrodes with a geometery
     that uses shear forces to provide adhesion. To measure the
     effectiveness of our latch we incorporated it into a 28cm x 28cm
     x 28cm modular robot. The result is a latch which requires almost
     zero static power and yet can hold over 0.6N/cm^2 of latch
     area.},
  keywords = {Actuation, Adhesion},
  url = {http://www.cs.cmu.edu/~claytronics/papers/karagozler-iros07.pdf},
}

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