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Stress-Driven MEMS Assembly + Electrostatic Forces = 1mm Diameter Robot

 

In Proceedings of the IEEE International Conference on Intelligent Robots and Systems (IROS '09)

Mustafa Emre Karagozler, Seth Copen Goldstein, and J. Robert Reid

October, 2009

Abstract


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@inproceedings{karagozler-iros09,
  author = {Karagozler, Mustafa Emre and Goldstein, Seth Copen and
     Reid, J. Robert},
  title = {Stress-Driven MEMS Assembly + Electrostatic Forces = 1mm
     Diameter Robot},
  booktitle = {Proceedings of the IEEE International Conference on
     Intelligent Robots and Systems ({IROS '09})},
  venue = {IEEE/RSJ International Conference on Intelligent Robots and
     Systems (IROS)},
  see = {karagozler-iros09},
  year = {2009},
  month = {October},
  abstract = {As the size of the modules in a self-reconfiguring
     modular robotic system shrinks and the number of modules
     increases, the flexibility of the system as a whole increases. In
     this paper, we describe the manufacturing methods and mechanisms
     for a 1 millimeter diameter module which can be manufactured en
     masse. The module is the first step towards realizing the basic
     unit of claytronics, a modular robotic system designed to scale
     to millions of units.},
  keywords = {Actuation, Adhesion, Robot Fabrication},
  url = {http://www.cs.cmu.edu/~claytronics/papers/karagozler-iros09.pdf}
}

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